Call for Papers
International Test Conference has been a flagship conference in test technology since 1970. With an attempt to stimulate more discussion and interaction between the academia and the industry around the globe, ITC-Asia was initiated as a sister conference of ITC in 2017. This year, it is again back to Taipei city, Taiwan. Welcome to join us to immerse ourselves in not only the state-of-the-art test technology, but also numerous semiconductor industry forums.
ITC-Asia 2022 will be a hybrid event, with in-person and online attendance.
Original papers on, but not limited to, the following areas are invited.
Topics of Interest include
Adaptive Test
ATE Design
Defect-Based Test
Design Validation and Debug
Diagnosis and Failure Analysis
Emerging Defect Mechanisms
Fault Tolerance
HW Security and Security HW
On-Chip Monitor
On-Line Test
Power and Thermal Issues
Reliability Issues
System-Level Test and Diagnosis
Test Compression
Test Economics
Test Generation & Fault Simulation
Yield Analysis and Learning
Pertaining to systems or underlying technologies including
Heterogeneous System-in-Package
High-Speed I/O
Internet of Things
MEMS, Sensors
Photonics Integrated Circuit
Quantum Devices
Regular paper submissions should be made electronically by PDF manuscripts only, not exceeding 6 pages in IEEE 2-column format (including abstract, figures, tables, and bibliography). A submission will be considered evidence that upon acceptance, at least one author will attend the conference to make the presentation. Authors of accepted papers are also responsible for preparing the final manuscripts in time to be included in the electronic proceedings, which will eventually be published in IEEEXplore Digital Library. At least one full registration to the conference is required for each accepted paper. Outstanding papers with extension will be invited to ITC’22.
 Template with MS Word format. 

 Template with LaTeX format. 

To registered & information about this conference check the source

Source : IEEE ITC