Call for Papers International Test Conference has been a flagship conference in test technology since 1970. With an attempt to stimulate more discussion and interaction between the academia and the industry around the globe, ITC-Asia was initiated as a sister conference of ITC in 2017. This year, it is again back to Taipei city, Taiwan. Welcome to join us to immerse ourselves in not only the state-of-the-art test technology, but also numerous semiconductor industry forums. ITC-Asia 2022 will be a hybrid event, with in-person and online attendance. Original papers on, but not limited to, the following areas are invited. Topics of Interest include Adaptive Test ATE Design Defect-Based Test Design Validation and Debug Design-for-Test Diagnosis and Failure Analysis Emerging Defect Mechanisms Fault Tolerance HW Security and Security HW On-Chip Monitor On-Line Test Power and Thermal Issues Reliability Issues System-Level Test and Diagnosis Test Compression Test Economics Test Generation & Fault Simulation Yield Analysis and Learning Pertaining to systems or underlying technologies including 5G/6G/RF Analog/Mixed-Signal Automotive Heterogeneous System-in-Package High-Speed I/O Internet of Things Memory MEMS, Sensors Photonics Integrated Circuit Quantum Devices Submission: Regular paper submissions should be made electronically by PDF manuscripts only, not exceeding 6 pages in IEEE 2-column format (including abstract, figures, tables, and bibliography). A submission will be considered evidence that upon acceptance, at least one author will attend the conference to make the presentation. Authors of accepted papers are also responsible for preparing the final manuscripts in time to be included in the electronic proceedings, which will eventually be published in IEEEXplore Digital Library. At least one full registration to the conference is required for each accepted paper. Outstanding papers with extension will be invited to ITC’22. Template: Template with MS Word format.
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